Abstract
The thermal conductivities of carbon nanotube (CNT)-copper (Cu) composites are greatly increased for compositions containing up to 1 vol.% CNT and remain above the value for pure Cu up to 3 vol.% CNT. The obtained enhancement was in good agreement with estimates based on Eshelby's equivalent inclusion method. This agreement suggests that very low thermal resistance might be realized at the interface between CNTs and the Cu matrix, which consists of faceted and closely attached interface without any compounds.
| Original language | English |
|---|---|
| Pages (from-to) | 375-378 |
| Number of pages | 4 |
| Journal | Scripta Materialia |
| Volume | 63 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2010 Aug 1 |
Keywords
- Carbon nanotubes
- Copper
- Metal matrix composites (MMC)
- Powder metallurgy
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys
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Cho, S., Kikuchi, K., Miyazaki, T., Takagi, K., Kawasaki, A., & Tsukada, T. (2010). Multiwalled carbon nanotubes as a contributing reinforcement phase for the improvement of thermal conductivity in copper matrix composites. Scripta Materialia, 63(4), 375-378. https://doi.org/10.1016/j.scriptamat.2010.04.024