Multilithic 3D and Heterogeneous Integration Using Capillary Self-Assembly

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We have worked on multichip-to-wafer (MC2W) 3D and heterogeneous integration and packaging using capillary self-assembly (CSA) with liquid droplets. In this work, microbump bonding and direct bonding technologies in face-up and/or facedown fashion are discussed for 3D-IC fabrication including 3D interconnect formation. Here 'non-transfer 3D stacking' like flip-chip bonding and 'transfer stacking' called reconfigure-wafer-to-wafer using self-assembly and electrostatic (SAE) carrier are explained. In addition, CSA application in flexible hybrid electronics (FHE) and micro-LED display is introduced.

Original languageEnglish
Title of host publication4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728125381
DOIs
Publication statusPublished - 2020 Apr
Event4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Penang, Malaysia
Duration: 2020 Apr 62020 Apr 21

Publication series

Name4th Electron Devices Technology and Manufacturing Conference, EDTM 2020 - Proceedings

Conference

Conference4th Electron Devices Technology and Manufacturing Conference, EDTM 2020
CountryMalaysia
CityPenang
Period20/4/620/4/21

Keywords

  • 3D integration
  • FHE
  • heterogeneous integration
  • massively parallel capillary self-assembly
  • micro-LED
  • multichip-to-wafer bonding

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering
  • Electronic, Optical and Magnetic Materials

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