Multidimensional VCSEL-array push/pull module fabricated using the self-alignment mounting technique

Hideo Kosaka, Mikihiro Kajita, Yoshimasa Sugimoto

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

We have developed plastic-molded receptacle-lope vertical-cavity surface-emitting laser (VCSEL)-array modules directly push/pull connectable with the one-dimensional (1-D) conventional mechanically-transferable multifiber push-on (MPO) fiber connector and with a new two-dimensional (2-D) MPO-compatible fiber connector developed for this module. The VCSEL was mounted on the plastic-molded package using a highly precise completely alignment-free process using flip-chip solder bonding and ball-guide die bonding. These modules exhibit an optical coupling loss of 0.67 ± 0.23 dB (efficiency: 85.8 ± 2.93%) and a loss deviation of less than 0.26 dB for 100 matings with the fiber connector (MMF50). The modules were operated at a bit rate of 1 Gbps/ch without an isolator and showed floorless bit error rate (BER) performance at temperatures up to 70°C. At 1 Gbps/ch their optical sensitivity at a BER of 10-11 was -26.0 dBm ± 0.9 dB. These structures and techniques are applicable to high-density, high-throughput optical parallel interconnections and optical space-division switches.

Original languageEnglish
Pages (from-to)471-478
Number of pages8
JournalIEEE Transactions on Components Packaging and Manufacturing Technology Part B
Volume21
Issue number4
DOIs
Publication statusPublished - 1998 Nov

Keywords

  • Optical fiber coupling
  • Optical interconnections
  • Parallel processing
  • Plastic packaging
  • Semiconductor device packaging
  • Semiconductor laser arrays
  • Surface mounting
  • Surface-emitting lasers

ASJC Scopus subject areas

  • Engineering(all)

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