Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration

Sungho Lee; Rui Liang; Yuki Miwa; Hisashi Kino; Takafumi Fukushima; Tetsu Tanaka

doi:10.23919/LTB-3D.2019.8735115

Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration

Sungho Lee, Rui Liang, Yuki Miwa, Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Impact of temporary bonding conditions and temporary adhesive properties on mechanical stresses in multichip thinning is evaluated for high-yield multichip-to-wafer (MC2W) heterogeneous 3D integration. It turned out that no sidewall covering of chips with a temporary adhesive gives low mechanical stress to the chip edge, leading to less chipping and cracking.

Original language	English
Title of host publication	Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Publisher	Institute of Electrical and Electronics Engineers Inc.
Number of pages	1
ISBN (Electronic)	9784904743072
DOIs	https://doi.org/10.23919/LTB-3D.2019.8735115
Publication status	Published - 2019 May
Event	6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 - Kanazawa, Ishikawa, Japan Duration: 2019 May 21 → 2019 May 25

Publication series

Name	Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019

Conference

Conference	6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019
Country	Japan
City	Kanazawa, Ishikawa
Period	19/5/21 → 19/5/25

ASJC Scopus subject areas

Process Chemistry and Technology
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.23919/LTB-3D.2019.8735115

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Cite this

Lee, S., Liang, R., Miwa, Y., Kino, H., Fukushima, T., & Tanaka, T. (2019). Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration. In Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019 [8735115] (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/LTB-3D.2019.8735115

Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration. / Lee, Sungho; Liang, Rui; Miwa, Yuki; Kino, Hisashi ; Fukushima, Takafumi ; Tanaka, Tetsu.

Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. 8735115 (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Lee, S, Liang, R, Miwa, Y, Kino, H , Fukushima, T & Tanaka, T 2019, Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration. in Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019., 8735115, Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Institute of Electrical and Electronics Engineers Inc., 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019, Kanazawa, Ishikawa, Japan, 19/5/21. https://doi.org/10.23919/LTB-3D.2019.8735115

Lee S, Liang R, Miwa Y, Kino H , Fukushima T , Tanaka T. Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration. In Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc. 2019. 8735115. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019). https://doi.org/10.23919/LTB-3D.2019.8735115

Lee, Sungho ; Liang, Rui ; Miwa, Yuki ; Kino, Hisashi ; Fukushima, Takafumi ; Tanaka, Tetsu. / Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration. Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019. Institute of Electrical and Electronics Engineers Inc., 2019. (Proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2019).

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