Multi-wafer bonding technology for the integration of a micromachined Mirau interferometer

Wei Shan Wang, Justine Lullin, Joerg Froemel, Maik Wiemer, Sylwester Bargiel, Nicolas Passilly, Christophe Gorecki, Thomas Gessner

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

The paper presents the multi-wafer bonding technology as well as the integration of electrical connection to the zscanner wafer of the micromachined array-type Mirau interferometer. A Mirau interferometer, which is a key-component of optical coherence tomography (OCT) microsystem, consists of a microlens doublet, a MOEMS Z-scanner, a focusadjustment spacer and a beam splitter plate. For the integration of this MOEMS device heterogeneous bonding of Si, glass and SOI wafers is necessary. Previously, most of the existing methods for multilayer wafer bonding require annealing at high temperature, i.e., 1100°C. To be compatible with MEMS devices, bonding of different material stacks at temperatures lower than 400°C has also been investigated. However, if more components are involved, it becomes less effective due to the alignment accuracy or degradation of surface quality of the not-bonded side after each bonding operation. The proposed technology focuses on 3D integration of heterogeneous building blocks, where the assembly process is compatible with the materials of each wafer stack and with position accuracy which fits optical requirement. A demonstrator with up to 5 wafers bonded lower than 400°C is presented and bond interfaces are evaluated. To avoid the complexity of through wafer vias, a design which creates electrical connections along vertical direction by mounting a wafer stack on a flip chip PCB is proposed. The approach, which adopts vertically-stacked wafers along with electrical connection functionality, provides not only a space-effective integration of MOEMS device but also a design where the Mirau stack can be further integrated with other components of the OCT microsystem easily.

Original languageEnglish
Title of host publicationMOEMS and Miniaturized Systems XIV
EditorsYong-Hwa Park, Wibool Piyawattanametha
PublisherSPIE
ISBN (Electronic)9781628414653
DOIs
Publication statusPublished - 2015
Externally publishedYes
EventMOEMS and Miniaturized Systems XIV - San Francisco, United States
Duration: 2015 Feb 92015 Feb 12

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume9375
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Other

OtherMOEMS and Miniaturized Systems XIV
CountryUnited States
CitySan Francisco
Period15/2/915/2/12

Keywords

  • 3-D integration
  • MOEMS
  • Mirau micro-interferometer
  • anodic bonding
  • multi-wafer bonding

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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