Multi-wafer bonding, stacking and interconnecting of integrated 3-D MEMS micro scanners

M. Wiemer, D. Wuensch, J. Frömel, T. Gessner, S. Bargiel, M. Barański, N. Passilly, C. Gorecki

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

In this work we describe the bonding and contacting of a micro machined vertically integrated 3-D micro scanner, which is a key-component for a number of scanning imaging micro systems, such as confocal microscopes on-chip or optical coherence tomography (OCT) probes for micro endoscopy. The 3-D micro scanner is composed of two electrostatic silicon MEMS micro actuators which are vertically aligned and bonded with glass and ceramic components to create hermetically sealed cavity for scanning micro lenses. In addition, the through wafer vias (TWV) technology is employed to establish electrical connection from the top to the bottom through a stack of two SOI wafers, one glass wafer and one ceramic wafer. Presented methods are of general importance for various silicon-based vertically integrated devices.

Original languageEnglish
Pages (from-to)128-133
Number of pages6
JournalInternational Journal of Microwave and Optical Technology
Volume9
Issue number1
Publication statusPublished - 2014 Jan 1
Externally publishedYes

Keywords

  • Assembly technology
  • Bonding
  • Glass micro lens
  • MOEMS
  • Optical micro scanner
  • Vertical integration

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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