TY - GEN
T1 - Multi-level Metallization on an Elastomer PDMS for FOWLP-based Flexible Hybrid Electronics
AU - Wang, Zhe
AU - Ozawa, Ikumi
AU - Susumago, Yuki
AU - Odashima, Tomo
AU - Takahashi, Noriyuki
AU - Kino, Hisashi
AU - Tanaka, Tetsu
AU - Fukushima, Takafumi
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/7/6
Y1 - 2021/7/6
N2 - In order to fabricate a wearable flexible display as a flexible hybrid electronic (FHE) device with micro-LED dies, we demonstrate multi-level metallization on an elastomer using die-first fan-out wafer-level packaging (FOWLP). The elastic substrate of this display is PDMS (polydimethylsiloxane) in which the array of 3-color micro-LEDs is embedded. In this study, we address serious issues such as die shift and stress accumulation in advanced FOWLP to integrate a self-luminescent flexible micro-LED display.
AB - In order to fabricate a wearable flexible display as a flexible hybrid electronic (FHE) device with micro-LED dies, we demonstrate multi-level metallization on an elastomer using die-first fan-out wafer-level packaging (FOWLP). The elastic substrate of this display is PDMS (polydimethylsiloxane) in which the array of 3-color micro-LEDs is embedded. In this study, we address serious issues such as die shift and stress accumulation in advanced FOWLP to integrate a self-luminescent flexible micro-LED display.
UR - http://www.scopus.com/inward/record.url?scp=85116266528&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85116266528&partnerID=8YFLogxK
U2 - 10.1109/IITC51362.2021.9537540
DO - 10.1109/IITC51362.2021.9537540
M3 - Conference contribution
AN - SCOPUS:85116266528
T3 - 2021 IEEE International Interconnect Technology Conference, IITC 2021
BT - 2021 IEEE International Interconnect Technology Conference, IITC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 24th Annual IEEE International Interconnect Technology Conference, IITC 2021
Y2 - 6 July 2021 through 9 July 2021
ER -