Multi-band radio-frequency filters fabricated using polyimide-based membrane transfer bonding technology

Takeshi Matsumura, Masayoshi Esashi, Hiroshi Harada, Shuji Tanaka

Research output: Contribution to journalArticlepeer-review

22 Citations (Scopus)

Abstract

In this paper, we present a polyimide-based Si membrane transfer bonding technology and its application to CMOS-compatible integration of different modes of AlN/Si composite piezoelectric MEMS resonators. The thermosetting polyimide, which has excellent chemical resistance and thermal stability, is used as a bonding adhesion, and is successfully removed as a sacrificial layer by O 2 plasma to release free-standing MEMS devices. The whole process temperature is below 350 °C and compatible with CMOS LSI. Using this technology, different modes of AlN/Si resonators, which are film bulk acoustic wave resonators and wine-glass mode disk-type resonators, have been co-fabricated on the same wafer. We also fabricated a ladder-type FBAR filter with a center frequency of 7.71 GHz and a mechanically coupled disk-array filter with a center frequency of 292.8 GHz.

Original languageEnglish
Article number095027
JournalJournal of Micromechanics and Microengineering
Volume20
Issue number9
DOIs
Publication statusPublished - 2010 Sep 1

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Multi-band radio-frequency filters fabricated using polyimide-based membrane transfer bonding technology'. Together they form a unique fingerprint.

Cite this