Monitoring of inner wall condition in mass-production plasma etching process using a load impedance monitoring system

Yuji Kasashima, Hiroyuki Kurita, Naoya Kimura, Akira Ando, Fumihiko Uesugi

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

This work describes the detection of changes in the inner wall condition of mass-production plasma etching equipment using a load impedance monitoring system. The system detects the change in the imaginary part of the load impedance from a 50-Ω transmission line when the inner wall condition changes following exposure to the atmosphere. The results demonstrate that the system can be used as a practical method for real-time and noninvasive monitoring of the wall condition of etching chambers. This method will contribute to improvements in production yield and overall equipment effectiveness, and the development of predictive maintenance in semiconductor manufacturing.

Original languageEnglish
Article number060301
JournalJapanese journal of applied physics
Volume54
Issue number6
DOIs
Publication statusPublished - 2015 Jun 1

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

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