Molecular scale mechanism of thermal resistance at solid-liquid interfaces (influence of interaction parameters between solid and liquid molecules)

Daichi Torii, Taku Ohara, Kenji Ishida

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Nonequilibrium molecular dynamics simulations have been performed for systems of a liquid film confined between atomistic solid walls. The two solid walls have different temperatures to generate a steady thermal energy flux in the system, which is the element of macroscopic heat conduction flux. Three kinds of liquid molecules and three kinds of solid walls are examined, and the thermal energy flux is measured at control surfaces in the liquid film and at the solid-liquid interfaces. By analyzing the thermal energy flux in detail by decomposing it into several molecular-scale contributions, influence of interaction parameters between solid and liquid molecules and the spacing of molecular alignment on the surface of the solid wall are clarified, and the molecular-scale mechanisms that govern the thermal resistance at a solid-liquid interface are elucidated.

Original languageEnglish
Title of host publication2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Pages23-31
Number of pages9
DOIs
Publication statusPublished - 2007 Dec 1
Event2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007 - Vancouver, BC, Canada
Duration: 2007 Jul 82007 Jul 12

Publication series

Name2007 Proceedings of the ASME/JSME Thermal Engineering Summer Heat Transfer Conference - HT 2007
Volume1

Other

Other2007 ASME/JSME Thermal Engineering Summer Heat Transfer Conference, HT 2007
CountryCanada
CityVancouver, BC
Period07/7/807/7/12

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Condensed Matter Physics

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