Molecular dynamics simulation of nano-contact between a diamond cutting tool and a copper surface

Yindi Cai, Yuanliu Chen, Yuki Shimizu, So Ito, Wei Gao, Ying Chen

Research output: Contribution to conference › Paper

Abstract

This paper presents molecular dynamics simulation on nanoindentation of diamond indenter on a copper workpiece. Surface damages of the workpiece are caused in the contact detection process for ultra-precision fabrication and form measurement of surface by using a force sensor-integrated fast tool servo. Molecular dynamics simulations are carried out in this paper to theoretically investigate the geometries of the damages due to the contact deformation. Taking into consideration of the holding period at the maximum indentation depth between the loading and the unloading processes, the dependence of the indentation geometry on the holding time are observed. Based on the simulation results, physical properties of the workpiece are also analyzed.

Original languageEnglish
Publication statusPublished - 2015 Oct 18
Event8th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2015 - Kyoto, Japan
Duration: 2015 Oct 18 → 2015 Oct 22

Other

Other8th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2015
CountryJapan
CityKyoto
Period15/10/18 → 15/10/22

Keywords

  • Diamond tool
  • FS-FTS
  • Molecular dynamics (MD) simulation
  • Nano-contact
  • Surface damage

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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    • Cite this

    Cai, Y., Chen, Y., Shimizu, Y., Ito, S., Gao, W., & Chen, Y. (2015). Molecular dynamics simulation of nano-contact between a diamond cutting tool and a copper surface. Paper presented at 8th International Conference on Leading Edge Manufacturing in 21st Century, LEM 2015, Kyoto, Japan.