MnOxself-forming process for TFT electrode application

J. Koike, M. Sano, K. Hirota, K. Neishi, Y. Sutou

Research output: Contribution to conferencePaper

4 Citations (Scopus)

Abstract

Cu-Mn alloys were deposited on glass substrates and on oxidized n+la-Si substrates. After heat treatment, Mn reacted with the substrate materials to form Mn oxide, and acted as an adhesion promoter as well as a diffusion barrier layer. In addition, the I-V characteristics of soure-drain configuration exhibited Ohmic behavior.

Original languageEnglish
Pages103-104
Number of pages2
Publication statusPublished - 2008 Dec 1
Event15th International Display Workshops, IDW '08 - Niigata, Japan
Duration: 2008 Dec 32008 Dec 5

Other

Other15th International Display Workshops, IDW '08
CountryJapan
CityNiigata
Period08/12/308/12/5

ASJC Scopus subject areas

  • Hardware and Architecture
  • Human-Computer Interaction
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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    Koike, J., Sano, M., Hirota, K., Neishi, K., & Sutou, Y. (2008). MnOxself-forming process for TFT electrode application. 103-104. Paper presented at 15th International Display Workshops, IDW '08, Niigata, Japan.