Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via - μ-RS and μ-XRD study

M. Murugesan, J. C. Bea, H. Hashimoto, K. W. Lee, M. Koyanagi, T. Fukushima, T. Tanaka

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

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