Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission

Hisashi Kino, Masataka Tashiro, Yohei Sugawara, Seiya Tanikawa, Takafumi Fukushima, Tetsu Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Through-Si-via (TSV) with polymer liner formation has attracted considerable attention because a polymer liner can be formed easily by spin coating, and it has low dielectric constant and good coverage along the TSV surface. A polyimide (PI) was used as the polymer liner of TSV. However, there is a high charge-trap density in the PI layer. These charge traps leads to modulation of the parasitic capacitance present between the TSV metal and the Si substrate. Therefore, in this paper, we propose the deployment of polybenzoxazole (PBO) as the polymer-liner material of TSV for minimizing the capacitance modulation. In this study, a metal-insulator-semiconductor capacitor with blind TSV structure was fabricated with PBO and PI liners. Further, capacitance-voltage (C-V) characteristics of the fabricated MOS capacitor were evaluated. In case of the PBO liner, remarkable suppression of the C-V curve shift was observed as compared to that of the PI liner. These results indicate that the PBO is a promising TSV liner material for realizing high-performance, high-reliability, and low-cost three-dimensional stacked ICs.

Original languageEnglish
Title of host publicationIITC 2017 - 2017 IEEE International Interconnect Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509064731
DOIs
Publication statusPublished - 2017 Jul 5
Event2017 IEEE International Interconnect Technology Conference, IITC 2017 - Hsinchu, Taiwan, Province of China
Duration: 2017 May 162017 May 18

Publication series

NameIITC 2017 - 2017 IEEE International Interconnect Technology Conference

Other

Other2017 IEEE International Interconnect Technology Conference, IITC 2017
CountryTaiwan, Province of China
CityHsinchu
Period17/5/1617/5/18

Keywords

  • 3D IC
  • PBO
  • TSV
  • charge trap
  • polymer liner

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys
  • Electrical and Electronic Engineering

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