Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections

Kota Nakahira; Fumiaki Endo; Ryosuke Furuya; Ken Suzuki; Hideo Miura

doi:10.1109/3DIC.2012.6262997

Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections

Kota Nakahira, Fumiaki Endo, Ryosuke Furuya, Ken Suzuki, Hideo Miura

ENG - Fracture and Reliability Research Institute

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Since the residual stress in a silicon chip mounted in 3D modules causes the degradation of both electrical and mechanical reliability, the dominant factors of the residual stress was investigated by using a finite element method and experiments applying 2-μm long piezoresistance strain gauges. The residual stress and local deformation of the chip were found to vary drastically depending on the mechanical properties of bumps and underfill and bump alignment structures.

Original language	English
Title of host publication	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs	https://doi.org/10.1109/3DIC.2012.6262997
Publication status	Published - 2011 Dec 1
Event	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan Duration: 2012 Jan 31 → 2012 Feb 2

Publication series

Name	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Other

Other	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
Country/Territory	Japan
City	Osaka
Period	12/1/31 → 12/2/2

ASJC Scopus subject areas

Control and Systems Engineering

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10.1109/3DIC.2012.6262997

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Nakahira, K., Endo, F., Furuya, R., Suzuki, K., & Miura, H. (2011). Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections. In 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 [6262997] (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011). https://doi.org/10.1109/3DIC.2012.6262997

Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections. / Nakahira, Kota; Endo, Fumiaki; Furuya, Ryosuke et al.

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 2011. 6262997 (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Nakahira, K, Endo, F, Furuya, R, Suzuki, K & Miura, H 2011, Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections. in 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011., 6262997, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, Osaka, Japan, 12/1/31. https://doi.org/10.1109/3DIC.2012.6262997

Nakahira K, Endo F, Furuya R, Suzuki K , Miura H. Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections. In 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 2011. 6262997. (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011). doi: 10.1109/3DIC.2012.6262997

@inproceedings{81f8e0b8d4d64b5b87dc9913b5662577,

title = "Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections",

abstract = "Since the residual stress in a silicon chip mounted in 3D modules causes the degradation of both electrical and mechanical reliability, the dominant factors of the residual stress was investigated by using a finite element method and experiments applying 2-μm long piezoresistance strain gauges. The residual stress and local deformation of the chip were found to vary drastically depending on the mechanical properties of bumps and underfill and bump alignment structures.",

author = "Kota Nakahira and Fumiaki Endo and Ryosuke Furuya and Ken Suzuki and Hideo Miura",

year = "2011",

month = dec,

day = "1",

doi = "10.1109/3DIC.2012.6262997",

language = "English",

isbn = "9781467321891",

series = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011",

booktitle = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011",

note = "2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 ; Conference date: 31-01-2012 Through 02-02-2012",

}

TY - GEN

T1 - Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections

AU - Nakahira, Kota

AU - Endo, Fumiaki

AU - Furuya, Ryosuke

AU - Suzuki, Ken

AU - Miura, Hideo

PY - 2011/12/1

Y1 - 2011/12/1

N2 - Since the residual stress in a silicon chip mounted in 3D modules causes the degradation of both electrical and mechanical reliability, the dominant factors of the residual stress was investigated by using a finite element method and experiments applying 2-μm long piezoresistance strain gauges. The residual stress and local deformation of the chip were found to vary drastically depending on the mechanical properties of bumps and underfill and bump alignment structures.

AB - Since the residual stress in a silicon chip mounted in 3D modules causes the degradation of both electrical and mechanical reliability, the dominant factors of the residual stress was investigated by using a finite element method and experiments applying 2-μm long piezoresistance strain gauges. The residual stress and local deformation of the chip were found to vary drastically depending on the mechanical properties of bumps and underfill and bump alignment structures.

UR - http://www.scopus.com/inward/record.url?scp=84866880293&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84866880293&partnerID=8YFLogxK

U2 - 10.1109/3DIC.2012.6262997

DO - 10.1109/3DIC.2012.6262997

M3 - Conference contribution

AN - SCOPUS:84866880293

SN - 9781467321891

T3 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

BT - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

T2 - 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Y2 - 31 January 2012 through 2 February 2012

ER -

Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections

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