Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections

Kota Nakahira, Fumiaki Endo, Ryosuke Furuya, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Since the residual stress in a silicon chip mounted in 3D modules causes the degradation of both electrical and mechanical reliability, the dominant factors of the residual stress was investigated by using a finite element method and experiments applying 2-μm long piezoresistance strain gauges. The residual stress and local deformation of the chip were found to vary drastically depending on the mechanical properties of bumps and underfill and bump alignment structures.

Original languageEnglish
Title of host publication2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs
Publication statusPublished - 2011 Dec 1
Event2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan
Duration: 2012 Jan 312012 Feb 2

Publication series

Name2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Other

Other2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
CountryJapan
CityOsaka
Period12/1/3112/2/2

ASJC Scopus subject areas

  • Control and Systems Engineering

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