Minimization of residual stress in TSV interconnections by controlling their crystallinity

Jiatong Liu, Takeru Kato, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The crystallinity of electroplated copper thin-film interconnections varies drastically depending on its manufacturing process, and thus, their mechanical and electrical properties change significantly depending on their micro texture. These changes should cause the variation of the residual stress in the interconnections, and thus, electronic performance of devices and the lifetime of interconnections should vary depending on the amplitude of the residual stress around TSV structures. The main reasons for high residual stress is attributed to not only thermal stress but also the shrinkage of the interconnections during their thermal history. Since the crystallinity of the interconnections varies drastically depending on their electroplating process, the residual stress after high temperature annealing is a strong function of the crystallinity. In this paper, the dominant process factors for changing the crystallinity and the residual stress in the electroplated interconnections were investigated by varying the electroplating process parameters systematically. Finally, it was found that the control of the crystallinity of a seed layer material used for the electroplating is the most important factor for controlling the crystallinity and long-term reliability of thin electroplated interconnections.

Original languageEnglish
Title of host publicationProceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages58-63
Number of pages6
ISBN (Electronic)9781467381215
DOIs
Publication statusPublished - 2016 Jul 20
Event15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 - Las Vegas, United States
Duration: 2016 May 312016 Jun 3

Publication series

NameProceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016

Other

Other15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016
CountryUnited States
CityLas Vegas
Period16/5/3116/6/3

Keywords

  • Atomic diffusion
  • EBSD analysis
  • Electroplated copper
  • Grain boundary
  • Lattice mismatch
  • Mechanical properties
  • Micro texture

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Hardware and Architecture
  • Mechanics of Materials

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