Miniaturized silicon capacitive accelerometer for downhole seismic measurement

H. Asanuma, M. Nishizawa, G. Suzuki, Y. Yoshida, H. Niitsuma, M. Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Microsensors have a potential to drastically improve subsurface measurement, because they have advantages in cost, installation, mobility and sensitivity to the conventional sensors. The authors have been developping a silicon capacitive micro accelerometer for downhole seismic detector under "Subsurface Microsensing Project" in Tohoku University, Japan. In this paper, the concept, design, packaging and field test of this seismic detector with microsensor is described. The micro accelerometer is fabricated using silicon and glass, and has a size of 9mm×5mm×2.2mm. The sensor has comparable sensitivity and frequency characteristics to high sensitive piezoelectric accelerometers. Three sensors are mounted on a circuit board and assembled in a sonde which protects the sensor/circuit from water in borehole. In situ detectability of seismic wave was evaluated in a small test field using artificial seismic source.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging; Manufacturing, Microelectronics Systems Systems and Exploratory Topics, Optoelectronics and Photonic Packaging
Pages1589-1592
Number of pages4
Publication statusPublished - 2001 Dec 1
EventAdvances in Electronic Packaging - Kauai, Hi, United States
Duration: 2001 Jul 82001 Jul 13

Publication series

NameAdvances in Electronic Packaging
Volume3

Other

OtherAdvances in Electronic Packaging
CountryUnited States
CityKauai, Hi
Period01/7/801/7/13

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering

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