TY - GEN
T1 - Microwave imaging of conductivity distribution of silicon wafers
AU - Ju, Yang
AU - Saka, Masumi
AU - Abé, Hiroyuki
PY - 2003/1/1
Y1 - 2003/1/1
N2 - Conductivity of silicon wafers was measured using the amplitude of the reflection coefficient of a microwave signal. A network analyzer was used to generate the microwave signal fed to a sensor and to measure the amplitude of the reflection coefficient. An open-ended coaxial line sensor was used to increase the spatial resolution and the sensitivity of the measurement. By microwave imaging, the distribution of the conductivity of a silicon wafer was mapped.
AB - Conductivity of silicon wafers was measured using the amplitude of the reflection coefficient of a microwave signal. A network analyzer was used to generate the microwave signal fed to a sensor and to measure the amplitude of the reflection coefficient. An open-ended coaxial line sensor was used to increase the spatial resolution and the sensitivity of the measurement. By microwave imaging, the distribution of the conductivity of a silicon wafer was mapped.
UR - http://www.scopus.com/inward/record.url?scp=1242309825&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=1242309825&partnerID=8YFLogxK
U2 - 10.1115/ipack2003-35117
DO - 10.1115/ipack2003-35117
M3 - Conference contribution
AN - SCOPUS:1242309825
SN - 0791836908
SN - 9780791836903
T3 - Advances in Electronic Packaging
SP - 61
EP - 64
BT - Advances in Electronic Packaging 2003
PB - American Society of Mechanical Engineers
T2 - 2003 International Electronic Packaging Technical Conference and Exhibition
Y2 - 6 July 2003 through 11 July 2003
ER -