Microwave imaging of conductivity distribution of silicon wafers

Yang Ju, Masumi Saka, Hiroyuki Abé

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Conductivity of silicon wafers was measured using the amplitude of the reflection coefficient of a microwave signal. A network analyzer was used to generate the microwave signal fed to a sensor and to measure the amplitude of the reflection coefficient. An open-ended coaxial line sensor was used to increase the spatial resolution and the sensitivity of the measurement. By microwave imaging, the distribution of the conductivity of a silicon wafer was mapped.

Original languageEnglish
Title of host publicationAdvances in Electronic Packaging 2003
Subtitle of host publicationVolume 1
PublisherAmerican Society of Mechanical Engineers
Pages61-64
Number of pages4
ISBN (Print)0791836908, 9780791836903
DOIs
Publication statusPublished - 2003 Jan 1
Event2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI, United States
Duration: 2003 Jul 62003 Jul 11

Publication series

NameAdvances in Electronic Packaging
Volume1

Other

Other2003 International Electronic Packaging Technical Conference and Exhibition
CountryUnited States
CityHaui, HI
Period03/7/603/7/11

ASJC Scopus subject areas

  • Engineering(all)
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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