Microwave imaging of conductivity distribution of silicon wafers

Yang Ju; Masumi Saka; Hiroyuki Abé

doi:10.1115/ipack2003-35117

Microwave imaging of conductivity distribution of silicon wafers

Yang Ju, Masumi Saka, Hiroyuki Abé

ENG - Finemechanics

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Conductivity of silicon wafers was measured using the amplitude of the reflection coefficient of a microwave signal. A network analyzer was used to generate the microwave signal fed to a sensor and to measure the amplitude of the reflection coefficient. An open-ended coaxial line sensor was used to increase the spatial resolution and the sensitivity of the measurement. By microwave imaging, the distribution of the conductivity of a silicon wafer was mapped.

Original language	English
Title of host publication	Advances in Electronic Packaging 2003
Subtitle of host publication	Volume 1
Publisher	American Society of Mechanical Engineers
Pages	61-64
Number of pages	4
ISBN (Print)	0791836908, 9780791836903
DOIs	https://doi.org/10.1115/ipack2003-35117
Publication status	Published - 2003 Jan 1
Event	2003 International Electronic Packaging Technical Conference and Exhibition - Haui, HI, United States Duration: 2003 Jul 6 → 2003 Jul 11

Publication series

Name	Advances in Electronic Packaging
Volume	1

Other

Other	2003 International Electronic Packaging Technical Conference and Exhibition
Country/Territory	United States
City	Haui, HI
Period	03/7/6 → 03/7/11

ASJC Scopus subject areas

Engineering(all)
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

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10.1115/ipack2003-35117

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Ju, Y, Saka, M & Abé, H 2003, Microwave imaging of conductivity distribution of silicon wafers. in Advances in Electronic Packaging 2003: Volume 1. Advances in Electronic Packaging, vol. 1, American Society of Mechanical Engineers, pp. 61-64, 2003 International Electronic Packaging Technical Conference and Exhibition, Haui, HI, United States, 03/7/6. https://doi.org/10.1115/ipack2003-35117

@inproceedings{42636c74d57e4c249b84ceecccf85d3d,

title = "Microwave imaging of conductivity distribution of silicon wafers",

abstract = "Conductivity of silicon wafers was measured using the amplitude of the reflection coefficient of a microwave signal. A network analyzer was used to generate the microwave signal fed to a sensor and to measure the amplitude of the reflection coefficient. An open-ended coaxial line sensor was used to increase the spatial resolution and the sensitivity of the measurement. By microwave imaging, the distribution of the conductivity of a silicon wafer was mapped.",

author = "Yang Ju and Masumi Saka and Hiroyuki Ab{\'e}",

year = "2003",

month = jan,

day = "1",

doi = "10.1115/ipack2003-35117",

language = "English",

isbn = "0791836908",

series = "Advances in Electronic Packaging",

publisher = "American Society of Mechanical Engineers",

pages = "61--64",

booktitle = "Advances in Electronic Packaging 2003",

note = "2003 International Electronic Packaging Technical Conference and Exhibition ; Conference date: 06-07-2003 Through 11-07-2003",

}

TY - GEN

T1 - Microwave imaging of conductivity distribution of silicon wafers

AU - Ju, Yang

AU - Saka, Masumi

AU - Abé, Hiroyuki

PY - 2003/1/1

Y1 - 2003/1/1

N2 - Conductivity of silicon wafers was measured using the amplitude of the reflection coefficient of a microwave signal. A network analyzer was used to generate the microwave signal fed to a sensor and to measure the amplitude of the reflection coefficient. An open-ended coaxial line sensor was used to increase the spatial resolution and the sensitivity of the measurement. By microwave imaging, the distribution of the conductivity of a silicon wafer was mapped.

AB - Conductivity of silicon wafers was measured using the amplitude of the reflection coefficient of a microwave signal. A network analyzer was used to generate the microwave signal fed to a sensor and to measure the amplitude of the reflection coefficient. An open-ended coaxial line sensor was used to increase the spatial resolution and the sensitivity of the measurement. By microwave imaging, the distribution of the conductivity of a silicon wafer was mapped.

UR - http://www.scopus.com/inward/record.url?scp=1242309825&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=1242309825&partnerID=8YFLogxK

U2 - 10.1115/ipack2003-35117

DO - 10.1115/ipack2003-35117

M3 - Conference contribution

AN - SCOPUS:1242309825

SN - 0791836908

SN - 9780791836903

T3 - Advances in Electronic Packaging

SP - 61

EP - 64

BT - Advances in Electronic Packaging 2003

PB - American Society of Mechanical Engineers

T2 - 2003 International Electronic Packaging Technical Conference and Exhibition

Y2 - 6 July 2003 through 11 July 2003

ER -

Microwave imaging of conductivity distribution of silicon wafers

Abstract

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ASJC Scopus subject areas

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