Microtexture and electrical and mechanical properties of the cold-sprayed copper deposit

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Cold-spray (CS) technique is a new coating technology that is based on the high-velocity impinging of small solid particles on a substrate. The CS technique can make a thick deposit with less heat influence. Recently, this CS technique has been applied to the formation of an electrically conductive copper layer on dielectric materials such as polymers or ceramics. Previous researches show that the deposits made by the CS technique have high strength and residual stress comparing with bulk copper. However, since the deposits show brittle fracture and cracks propagate along the interfaces of the deposited particles, the deposits can not be applied to the products for which high reliability is indispensable. Therefore, it is very important to clarify the dominant factors which change the crystallinity of the deposits comparing with that of bulk copper in order to improve the quality of the deposits. One of the important factors should be the integrity of the interfaces between the deposited fine particles. This study is to evaluate the micro-texture and physical properties of the cold-sprayed copper deposit. Electron back-scatter diffraction method was applied to the evaluation of the crystallinity of the deposits. In addition, the relationship between the crystallinity with both mechanical and electrical properties of the deposits was clarified quantitatively.

Original languageEnglish
Title of host publicationASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
DOIs
Publication statusPublished - 2013 Dec 1
EventASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 - Burlingame, CA, United States
Duration: 2013 Jul 162013 Jul 18

Publication series

NameASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
Volume1

Other

OtherASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013
CountryUnited States
CityBurlingame, CA
Period13/7/1613/7/18

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Computer Networks and Communications
  • Computer Science Applications
  • Hardware and Architecture
  • Information Systems
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Watanabe, Y., Ichikawa, Y., Ogawa, K., & Miura, H. (2013). Microtexture and electrical and mechanical properties of the cold-sprayed copper deposit. In ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013 (ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013; Vol. 1). https://doi.org/10.1115/IPACK2013-73150