Microsystems by bulk micromachining

M. Esashi

Research output: Contribution to conferencePaper

1 Citation (Scopus)

Abstract

Deep RIE (Reactive Ion Etching) was developed not only for silicon but also for other materials and silicon microstructures made by the deep RIE was used as molds for making ceramic microstructures. Packaged micro mechanical sensors as pressure sensors and electrostatically levitating micro motors for gyroscope have been developed. Microprobes are fabricated for future data storage devices. Energy dissipation of resonating thin cantilever was studied for large Q factor required for highly sensitive resonating sensors. Active catheters which move like snakes in blood vessel and sensors for the catheter have been studied for the purpose of minimal invasive medicine.

Original languageEnglish
DOIs
Publication statusPublished - 2000 Jan 1
Event2000 30th European Microwave Conference, EuMC 2000 - Paris, France
Duration: 2000 Oct 22000 Oct 5

Other

Other2000 30th European Microwave Conference, EuMC 2000
CountryFrance
CityParis
Period00/10/200/10/5

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Microsystems by bulk micromachining'. Together they form a unique fingerprint.

  • Cite this

    Esashi, M. (2000). Microsystems by bulk micromachining. Paper presented at 2000 30th European Microwave Conference, EuMC 2000, Paris, France. https://doi.org/10.1109/EUMA.2000.338707