Microstructure and thermal expansion properties of invar-type Cu-Zn-Al shape memory alloys

J. J. Wang, T. Omori, Y. Sutou, R. Kainuma, K. Ishida

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)

Abstract

The effects of grain size, volume fraction of the α (fcc) phase in the β(bcc) matrix, and thermal stability on low thermal expansion (LTE) properties of Cu-Zn-Al shape memory (SM) alloys induced by cold rolling were investigated by dilatometry, optical microscopy, differential scanning calorimetry, and electrical conductivity measurements. The alloys with the larger grains showed a superior two-way memory (TWM) effect, wider LTE temperature intervals with excellent thermal stability under 80°C. The α + β two-phase alloys also exhibited a good combination of cold workability and LTE properties. These results suggest that the Cu-Zn-Al alloys with high electrical conductivity of about 20% International Annealed Copper Standard (%IACS) have high potential as a new class of Invar alloys that can be applied in various fields.

Original languageEnglish
Pages (from-to)1098-1102
Number of pages5
JournalJournal of Electronic Materials
Volume33
Issue number10
DOIs
Publication statusPublished - 2004 Oct

Keywords

  • Cold working
  • Cu-Zn-Al
  • Low thermal expansion (LTE)
  • Martensitic transformation
  • Shape memory (SM) effect

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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