Microstructure and electrochemical behavior of Pd-Cu-Ni-P bulk metallic glass and its crystallized alloys

F. X. Qin, T. Wada, G. Q. Xie, S. L. Zhu, A. Inoue

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The microstructure and electrochemical behavior of the Pd 42.5Cu 30Ni 7.5P 20 as-quenched bulk metallic glass and its crystallized alloys after heat-treatment at 623 and 723K were investigated. The results revealed that the Pd 42.5Cu 30Ni 7.5P 20 bulk metallic glass and its crystallized alloys were spontaneously passivated in 0.144M NaCl and Hanks' solution with a low passive current density and a wide passive region. The transpassive potential of the fully crystallized alloy heat-treated at a higher temperature was lower than those of the as-quenched bulk metallic glass and partially crystallized alloy. The difference in the microstructure of the as-quenched bulk metallic glass, the partially crystallized alloy and the fully crystallized alloy was responsible for their different transpassive potentials. The wider passive region of the alloys in Hanks' solution is attributed to the presence of HCO 3 -, HPO 4 2-, SO 4 2- and H 2PO 4 - ions in the solution, which act as corrosive inhibitors.

Original languageEnglish
Pages (from-to)936-939
Number of pages4
JournalMaterials Transactions
Volume53
Issue number5
DOIs
Publication statusPublished - 2012

Keywords

  • Bulk metallic glass
  • Corrosion
  • Microstructure
  • Palladium

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint

Dive into the research topics of 'Microstructure and electrochemical behavior of Pd-Cu-Ni-P bulk metallic glass and its crystallized alloys'. Together they form a unique fingerprint.

Cite this