Microstructure and electric conductivity of (SiC)TiN/Cu composites

Lin Zhang, Xin Lu, Xin Bo He, Xuan Hui Qu, Ming Li Qin, Hong Min Zhu

Research output: Contribution to journalArticlepeer-review

Abstract

TiN-coated SiC particles were prepared by the combination of alkoxide-hydrolysis and ammonia-nitridation. The coated composite powder was consolidated by spark plasma sintering. The results indicate that alkoxide-hydrolysis in combination with ammonia-nitridation is a suitable technique to produce TiN-coated SiC particles. The TiN film is thin and continuous, and the TiN particle size is about 30 to 80 nm, which is favorable to improve the densification and enhance interfacial bonding between the reinforcement and the matrix. The electric conductivity of (SiC)TiN/Cu composites is in the range of 15.5 to 35.7 m·Ω-1·mm-2 and decreases with increasing SiC content. The TiN film and the formation of a TiN network in the matrix contribute to the enhancement of electric conductivity. Additionally, the electric conductivity of the composites is more close to data predicted by the P.G model.

Original languageEnglish
Pages (from-to)1410-1415
Number of pages6
JournalBeijing Keji Daxue Xuebao/Journal of University of Science and Technology Beijing
Volume34
Issue number12
Publication statusPublished - 2012 Dec 1
Externally publishedYes

Keywords

  • Composite materials
  • Copper
  • Electric conductivity
  • Microstructure
  • Silicon carbide
  • Titanium nitride

ASJC Scopus subject areas

  • Engineering(all)

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