Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder

N. Kawamoto, Y. Murakami, D. Shindo, K. Suganuma

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)

    Abstract

    Microstructure of Ag-epoxy conductive adhesive, which is expected as a substitution for Pb-free solder, has been investigated by electron microscopy. The observations have demonstrated the presence of agglomerations of Ag particles, and they are likely to be connected to form huge conduction paths in a solidified state. Moreover, multidisciplinary tests (e.g., simultaneous examination of the microstructure and electric resistivity) on the solidified adhesives were performed inside the transmission electron microscope with the aid of mobile microprobes.

    Original languageEnglish
    Title of host publication6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings
    Pages101-104
    Number of pages4
    DOIs
    Publication statusPublished - 2007 Dec 1
    EventPolytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - Tokyo, Japan
    Duration: 2007 Jan 152007 Jan 18

    Publication series

    Name6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

    Other

    OtherPolytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
    Country/TerritoryJapan
    CityTokyo
    Period07/1/1507/1/18

    Keywords

    • Conductive adhesive
    • Electronic packaging
    • Fine particle
    • Microprobe
    • Transmission electron microscopy

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering
    • Electronic, Optical and Magnetic Materials
    • Polymers and Plastics

    Fingerprint

    Dive into the research topics of 'Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder'. Together they form a unique fingerprint.

    Cite this