Microstructure and conductivity analysis of silver-based conductive adhesive by TEM with double-probe piezodriving holder

N. Kawamoto, Y. Murakami, D. Shindo, K. Suganuma

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

Microstructure of Ag-epoxy conductive adhesive, which is expected as a substitution for Pb-free solder, has been investigated by electron microscopy. The observations have demonstrated the presence of agglomerations of Ag particles, and they are likely to be connected to form huge conduction paths in a solidified state. Moreover, multidisciplinary tests (e.g., simultaneous examination of the microstructure and electric resistivity) on the solidified adhesives were performed inside the transmission electron microscope with the aid of mobile microprobes.

Original languageEnglish
Title of host publication6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings
Pages101-104
Number of pages4
DOIs
Publication statusPublished - 2007 Dec 1
EventPolytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - Tokyo, Japan
Duration: 2007 Jan 152007 Jan 18

Publication series

Name6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

Other

OtherPolytronic 2007 - 6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
CountryJapan
CityTokyo
Period07/1/1507/1/18

Keywords

  • Conductive adhesive
  • Electronic packaging
  • Fine particle
  • Microprobe
  • Transmission electron microscopy

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Polymers and Plastics

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