Microstructure analysis and electrical properties of Cu-Mn electrode for back-channel etching a-IGZO TFT

Pilsang Yun, Junichi Koike

Research output: Contribution to conferencePaperpeer-review

4 Citations (Scopus)

Abstract

Cu-Mn alloy was investigated as an electrode on a-IGZO film because of its good adhesion, a diffusion barrier and a wet etching selectivity of about 10:1 with IGZO film. Contact property showed non-linear behavior with Al and Cu, while Ohmic contact was obtained with Cu-Mn and Ti after annealing.

Original languageEnglish
Pages1873-1876
Number of pages4
Publication statusPublished - 2010 Dec 1
Event17th International Display Workshops, IDW'10 - Fukuoka, Japan
Duration: 2010 Dec 12010 Dec 3

Other

Other17th International Display Workshops, IDW'10
CountryJapan
CityFukuoka
Period10/12/110/12/3

ASJC Scopus subject areas

  • Computer Vision and Pattern Recognition
  • Human-Computer Interaction

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