Microstructural Modeling and Thermal Property Simulation of Unidirectional Composite

Keiko Kikuchi, Yan Sheng Kang, Akira Kawasaki, Shinya Nishida, Akira Ichida

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

The electrical, thermal and mechanical properties of functionally graded materials vary with microstructure and composition. Consequently it is very important to know quantitatively the properties of composites for the design of functionally graded materials. However, few methods of quantitative and theoretical evaluation for material properties on wide compositional range have been established. In this research, a method that estimates the material properties of composites directly from their microstructure assisted with finite element analysis was investigated. As an example of the estimation of material properties, the thermal conductivity of Mo fiber-Cu matrix composites has been evaluated. Calculated results of thermal conductivity are well in agreement with the experimental data measured by using a laser flash apparatus and the smallest deviation is 1.9%. The finite element analysis using a metallographic model is a very accurate method for estimation of composite properties.

Original languageEnglish
Pages (from-to)542-549
Number of pages8
JournalMaterials Transactions
Volume45
Issue number2
DOIs
Publication statusPublished - 2004 Feb

Keywords

  • Copper-molybdenum composite
  • Microstructural modeling
  • Thermal conductivity
  • Unidirectional composite

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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