Microstructural influences on stress migration in electroplated Cu metallization

A. Sekiguchi, J. Koike, K. Maruyama

Research output: Contribution to journalArticlepeer-review

36 Citations (Scopus)

Abstract

A study to investigate the microstructural influences on stress migration in electroplated Cu metallization was presented. Incoherent twins in the 〈111〉 textured films whereas coherent twins in the random textured films were observed using transmission electron microscopy. It was found that the incoherent twins accompany stress-induced voids because of a weak bonding at twin interfaces.

Original languageEnglish
Pages (from-to)1962-1964
Number of pages3
JournalApplied Physics Letters
Volume83
Issue number10
DOIs
Publication statusPublished - 2003 Sep 8

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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