Abstract
A study to investigate the microstructural influences on stress migration in electroplated Cu metallization was presented. Incoherent twins in the 〈111〉 textured films whereas coherent twins in the random textured films were observed using transmission electron microscopy. It was found that the incoherent twins accompany stress-induced voids because of a weak bonding at twin interfaces.
| Original language | English |
|---|---|
| Pages (from-to) | 1962-1964 |
| Number of pages | 3 |
| Journal | Applied Physics Letters |
| Volume | 83 |
| Issue number | 10 |
| DOIs | |
| Publication status | Published - 2003 Sep 8 |
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)