Microstructural evolution of alloy powder for electronic materials with liquid miscibility gap

I. Ohnuma, T. Saegusa, Y. Takaku, C. P. Wang, X. J. Liu, R. Kainuma, K. Ishida

Research output: Contribution to journalArticlepeer-review

38 Citations (Scopus)

Abstract

The microstructure of powders that are applicable for electronic materials were studied for some systems in which there is a liquid miscibility gap. The characteristic morphologies of an egg-like core type and a uniform second-phase dispersion are shown in relation to the phase diagram, where thermodynamic calculations are a powerful tool for alloy design and the prediction of microstructure. Typical examples of microstructural evolution and properties of Pb-free solders and Ag-based micropowders with high electrical conductivity produced by a gas-atomizing method are presented.

Original languageEnglish
Pages (from-to)2-9
Number of pages8
JournalJournal of Electronic Materials
Volume38
Issue number1
DOIs
Publication statusPublished - 2009 Jan

Keywords

  • Liquid miscibility gap
  • Phase diagram
  • Powder
  • Thermodynamic calculation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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