Microstructural evolution during high-temperature tensile creep at 1,500°C of a MoSiBTiC alloy

Sojiro Uemura, Shiho Yamamoto Kamata, Kyosuke Yoshimi, Sadahiro Tsurekawa

Research output: Contribution to journalArticle

Abstract

Microstructural evolution in the TiC-reinforced Mo-Si-B-based alloy during tensile creep deformation at 1,500°C and 137 MPa was investigated via scanning electron microscope-backscattered electron diffraction (SEM-EBSD) observations. The creep curve of this alloy displayed no clear steady state but was dominated by the tertiary creep regime. The grain size of the Moss phase increased in the primary creep regime. However, the grain size of the Moss phase was found to remarkably decrease to <10 μm with increasing creep strain in the tertiary creep regime. The EBSD observations revealed that the refinement of the Moss phase occurred by continuous dynamic recrystallization including the transformation of low-angle grain boundaries to high-angle grain boundaries. Accordingly, the deformation of this alloy is most likely to be governed by the grain boundary sliding and the rearrangement of Moss grains such as superplasticity in the tertiary creep regime. In addition, the refinement of the Moss grains surrounding large plate-like T2 grains caused the rotation of their surfaces parallel to the loading axis and consequently the cavitation preferentially occurred at the interphases between the end of the rotated T2 grains and the Moss grains.

Original languageEnglish
Pages (from-to)136-145
Number of pages10
JournalHigh Temperature Materials and Processes
Volume39
Issue number1
DOIs
Publication statusPublished - 2020 Jan 1

Keywords

  • dynamic recovery
  • dynamic recrystallization
  • high-temperature deformation
  • microstructure
  • molybdenum

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Physical and Theoretical Chemistry

Fingerprint Dive into the research topics of 'Microstructural evolution during high-temperature tensile creep at 1,500°C of a MoSiBTiC alloy'. Together they form a unique fingerprint.

  • Cite this