Microscale bonding strength of Cu-Fe-Al transferred lamellar microstructure formed by copper-coated seel fine particle peening

Yuji Ichikawa, Ryotaro Tokoro, Yutaka Kameyama

Research output: Contribution to journalArticle

Abstract

Fine particle peening(FPP)is a surface modification process in which fine hard metallic particles project onto the substrate. During this process, shot particles that remain transfer to the substrate and form a complex and multi-layered lamellar structure in which transferred fragments are distributed in the depth direction and several tens of micrometers from the surface. Because the bond strength at each interface of this structure and its generation mechanism are unclear, the local bond strength of the laminated interface was evaluated in this study by a microscale tensile test conducted by focus ion beam facilities. In the transferred lamellar modified region, the hardness was considerably higher than that of as-received materials, and the microscopic bonding strength between the transferred copper or iron and the aluminum matrix was 300 MPa or greater. When steel particles were used with FPP, iron oxide was mainly transferred to the aluminum matrix. However, copper plating on the particles suppressed the oxidation of the steel composing the particles and, as a result, the metallic steel was transferred. The bonding strength was improved by oxidation-controlled steel particles.

Original languageEnglish
Pages (from-to)28-35
Number of pages8
JournalNippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals
Volume80
Issue number12
DOIs
Publication statusPublished - 2016 Jan 1

Keywords

  • Adhesion strength
  • Fine particle peening
  • Hybridized particle
  • Microstructure
  • Particle fragments transfer

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

Fingerprint Dive into the research topics of 'Microscale bonding strength of Cu-Fe-Al transferred lamellar microstructure formed by copper-coated seel fine particle peening'. Together they form a unique fingerprint.

  • Cite this