Abstract
In this work, new novel methods for fabricating a thermal probe array with 32 × 32 probes on one chip are proposed. It consists of silicon micromachined probe, AIN actuator, pyramidal SiO2 tip on which the nano-scale metal-metal junction is formed using a self-alignment technique. The nano-junction can be used as a thermocouple to measure a local temperature on a sample surface or as a nano-heater to make a local deformation on a media. In self-alignment process, a metal layer (Pt/Ni) is deposited on the inside of SiO2 hollow tip fabricated by low temperature (950 °C) oxidation of silicon etch pit. This low temperature oxidation results in a smaller oxide thickness at the tip apex than other flat area. Therefore, after selective etching the SiO2 in buffered HF, a small hole surrounding the Pt/Ti tip apex can be created. Another metal (Ni) is deposited outside the Pt/Ti tip to make the nano-junction. For electrical interconnection between the thermal probe and an IC chip, a hole array with 30 μm of a hole diameter is made by dry etching through the 150-μm-thick Pyrex glass, and then Ni is electroplated into the through etched-hole. Finally the Pyrex glass plate was anodically bonded to the probe array. Using the fabricated thermal probe, temperature distribution is measured on a prepared sample surface and the local heating capability of the thermal probe is confirmed. Preliminary experiments for data writing and reading are performed on a phase change medium.
Original language | English |
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Pages (from-to) | 215-221 |
Number of pages | 7 |
Journal | Journal of Microelectromechanical Systems |
Volume | 11 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2002 Jun 1 |
Keywords
- Data storage
- Electrical interconnection
- Microprobe
- Nano-heater
- Thermal imaging
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering