Micro/nano glass press molding using silicon carbide molds fabricated by silicon lost molding

Kyung Oh Min, Shuji Tanaka, Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Silicon carbide (SiC) molds for micro/nano glass press molding at high temperature were fabricated from a silicon molds. The silicon molds with the features of micro-optics were fabricated by photolithography and etching, and then SiC was deposited on the silicon mold. After the SiC surface was polished to a mirror surface, a SiC ceramic block was bonded with the SiC film using a nickel interlayer at 900°C. Finally, the silicon mold was etched away using the mixture of nitric acid and hydrofluoric acid. The surface roughness of the SiC mold is 1.2 nm Ra, which is almost identical with that of the silicon mold. This suggests that this process is promising to make the SiC mold for optical uses. Glass press molding was preliminarily performed at 400°C using the SiC mold coated with diamond-like carbon (DLC). Although some parts of the SiC film were peeled off due to poor SiC-SiC bonding quality, the features on the SiC mold were well transferred to the glass.

Original languageEnglish
Title of host publicationProceedings of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Technical Digest
Pages475-478
Number of pages4
DOIs
Publication statusPublished - 2005 Oct 25
Event18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami - Miami Beach, FL, United States
Duration: 2005 Jan 302005 Feb 3

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
ISSN (Print)1084-6999

Other

Other18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005 Miami
CountryUnited States
CityMiami Beach, FL
Period05/1/3005/2/3

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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