Micro/nano electro mechanical systems for practical applications

Masayoshi Esashi

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)


Silicon MEMS as electrostatically levitated rotational gyroscope, 2D optical scanner and wafer level packaged devices as integrated capacitive pressure sensor and MEMS switch are described. MEMS which use non-silicon materials as diamond, PZT, conductive polymer, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mould for glass press moulding and SAW wireless passive sensor respectively are also described.

Original languageEnglish
Article number012001
JournalJournal of Physics: Conference Series
Publication statusPublished - 2009
Externally publishedYes


  • Data storage
  • Gyroscope
  • MEMS
  • Packaging
  • Switch

ASJC Scopus subject areas

  • Physics and Astronomy(all)


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