Abstract
Fundamental technologies for the optical interconnection in the VLSI chip have been developed by using conventional Si LSI technologies. The micron-size optical waveguide consisting of Si3N4 core and SiO2 cladding layers has been fabricated by low-pressure chemical vapor deposition (LPCVD) and atmospheric-pressure chemical vapor deposition (APCVD), respectively. The small lenses and the micron-size mirror which changes the light propagation direction from vertical to horizontal for the interlayer interconnection have also been fabricated.
Original language | English |
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Pages (from-to) | 822-826 |
Number of pages | 5 |
Journal | Japanese journal of applied physics |
Volume | 33 |
Issue number | 1 |
DOIs | |
Publication status | Published - 1994 |
Externally published | Yes |
Keywords
- Microlens
- Micromirror
- Micron-size optical waveguide
- Optical interconnection
- Si LSI technologies
ASJC Scopus subject areas
- Engineering(all)
- Physics and Astronomy(all)