Micromaterials - II: Simulations for the properties and fracture behavior of micromaterials

Shoji Kamiya, Masumi Saka, Hiroyuki Abé

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)100-105
Number of pages6
JournalZairyo/Journal of the Society of Materials Science, Japan
Volume47
Issue number1
DOIs
Publication statusPublished - 1998 Jan 1

Keywords

  • Deformation
  • Electronic packaging
  • Fracture
  • Layered material
  • Micromachine
  • Optical fiber
  • Simulation
  • Thin film

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this