Micromachined structure for Si transmission optical components

Minoru Sasaki, Yuji Arai, Hitoshi Takebe, Wataru Kamada, Kazuhiro Hane

Research output: Contribution to journalConference articlepeer-review

Abstract

Recent progress of the deep reactive ion etching explores several new applications of three dimensional structures of silicon devices. We have developed new optical and electrical devices having the penetrating holes to transmit the optical beam to the down stream. The transmission silicon position sensor having the divided cell type photodiode on the Si mesh structure is fabricated. The beam splitter is considered to be integrated in this device and a part of the incident light beam is detected by the photodiode. Using nearly same technique, the pinhole of the spatial filter surrounded by the divided cell type photodiode is fabricated to detect the relative position between the incident beam spot and the center pinhole.

Original languageEnglish
Pages (from-to)89-94
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume3513
Publication statusPublished - 1998 Dec 1
EventProceedings of the 1998 Conference on Microelectronic Structures and MEMS for Optical Processing IV - Santa Clara, CA, USA
Duration: 1998 Sep 211998 Sep 22

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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