Layered-metal micro cantilever with a micro tip was fabricated and characterized for high-density data storage device. The cantilevers were fabricated by the sequential depositions of chromium, gold, and chromium layers by sputtering with their stress and thickness controlled. The reversed sputtering technique was utilized for fine patterning of the cantilevers and hence for good uniformity of cantilever's elevation height after sacrificial release. A micro protrusion was formed at the end position of the cantilever by the newly developed contact shadow mask process. The fabricated cantilevers were driven in the upward direction by the electro thermal Joule heat, and also in the downward direction by the electrostatic force between cantilever and the silicon substrate. A series of small dots as recorded in a thin film photoresist by using the indentation of the fabricated protrusion, which showed that the cantilevers would be applied to high-density data storage devices.