Micro-texture dependence of the strength of fine metallic bumps used for electronic packaging

Fumiaki Endo, Naokazu Murata, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Electroplated copper bumps expected as fine metallic bumps for electronic packaging were investigated experimentally considering the change of micro texture dependence of their electroplating conditions and heat treatment after the electroplating. Not only Young's modulus but also the strength of electroplated copper thin films changed drastically depending on the change of their micro texture, and these values were significantly different from conventional bulk copper. In addition, the strong anisotropy of Young's modulus was observed between that along their thickness direction, and that parallel to their plane direction.

Original languageEnglish
Title of host publicationASME 2012 International Mechanical Engineering Congress and Exposition, IMECE 2012
Pages995-1000
Number of pages6
EditionPARTS A AND B
DOIs
Publication statusPublished - 2012 Dec 1
EventASME 2012 International Mechanical Engineering Congress and Exposition, IMECE 2012 - Houston, TX, United States
Duration: 2012 Nov 92012 Nov 15

Publication series

NameASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
NumberPARTS A AND B
Volume9

Other

OtherASME 2012 International Mechanical Engineering Congress and Exposition, IMECE 2012
CountryUnited States
CityHouston, TX
Period12/11/912/11/15

ASJC Scopus subject areas

  • Mechanical Engineering

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