Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnections

Naokazu Murata, Naoki Saito, Fumiaki Endo, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

Both mechanical and electronic properties of electroplated copper films used for interconnections were investigated experimentally considering the change of their micro texture caused by heat treatment. Since those properties varied drastically depending on the electroplating conditions and thermal history after the electroplating, a novel evaluation method of the crystallinity of grains and grain boundaries of the electroplated copper thin films has been proposed by applying the conventional electron back scatter diffraction method. It was found the porous grain boundaries in the films cause brittle mechanical and electrical fractures of the films. The proposed method was effective for evaluating the crystallinity of grain boundaries quantitatively, and thus, estimating both the mechanical and electrical properties of the films used for mass production.

Original languageEnglish
Title of host publication2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages2119-2125
Number of pages7
DOIs
Publication statusPublished - 2011 Jul 21
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
Duration: 2011 May 312011 Jun 3

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2011 61st Electronic Components and Technology Conference, ECTC 2011
CountryUnited States
CityLake Buena Vista, FL
Period11/5/3111/6/3

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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