Micro texture control for highly reliable copper fine bumps for 3D integration

Masara Gotoh, Ken Suzuki, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The variation and fluctuation of mechanical properties of the electroplated copper fine bumps degrade the long-term reliability of the interconnections in 3D modules. The life of the fine bump joints under electro migration and stress-induced migration loads was investigated experimentally and it was confirmed that the micro texture of the fine bumps should be controlled appropriately in order to assure the long-term reliability. It was found that the formation of high quality columnar grains with (001) orientation can improve the reliability drastically.

Original languageEnglish
Title of host publication2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Subtitle of host publicationChallenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages53-56
Number of pages4
ISBN (Electronic)9781479977277
DOIs
Publication statusPublished - 2014 Jan 1
Event9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan, Province of China
Duration: 2014 Oct 222014 Oct 24

Publication series

Name2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Other

Other9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
CountryTaiwan, Province of China
CityTaipei
Period14/10/2214/10/24

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

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  • Cite this

    Gotoh, M., Suzuki, K., & Miura, H. (2014). Micro texture control for highly reliable copper fine bumps for 3D integration. In 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings (pp. 53-56). [7048346] (2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMPACT.2014.7048346