Micro-texture and physical properties of the cold-sprayed copper deposit

Yusuke Watanabe, Yuji Ichikawa, Isamu Nonaka, Hideo Miura

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

The cold spray (CS) method is a new deposition technique. In this technique, small solid particles impact and deposit on a substrate without melting. The deposition rate of the CS method is much higher than that of the other deposition processes. Expected applications of this technology are not only coating film production but also direct copper wiring technique for electronic products. This method also can be applied to patterning of thin films without photomasks. For example, an arbitrary geometry thin-film pattern can be formed on a substrate by scanning a spray nozzle. However, mechanical properties of the CS deposit and its micro-texture are found to be quite different from those of bulk copper. The previous researches showed that the CS deposit has high strength and indicates brittle-like fracture. The cold-sprayed copper deposit has a micro-texture which is stacked heavily deformed particles. The difference of the micro-texture between the cold-sprayed copper deposit and bulk copper is the main reason of the different mechanical properties. Thus, there is a possibility that the electrical properties of the cold-sprayed copper deposit are also different from bulk copper. In this study, both micro-texture and the electrical properties of the cold-sprayed copper deposit were measured by using SEM and EBSD technique and a four-point probe method. From the EBSD evaluation results, it was found that the average grain size in the deposited particles was much smaller than that of feed stock powder and bulk copper. The electrical resistivity of cold-sprayed copper deposit was much higher than that of bulk copper. The fine grain texture of the cold-sprayed copper deposit is one of the reasons for this high electrical resistivity.

Original languageEnglish
Title of host publication14th International Conference on Electronic Materials and Packaging, EMAP 2012
DOIs
Publication statusPublished - 2012 Dec 1
Event14th International Conference on Electronic Materials and Packaging, EMAP 2012 - Lantau Island, Hong Kong
Duration: 2012 Dec 132012 Dec 16

Publication series

Name14th International Conference on Electronic Materials and Packaging, EMAP 2012

Other

Other14th International Conference on Electronic Materials and Packaging, EMAP 2012
CountryHong Kong
CityLantau Island
Period12/12/1312/12/16

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Fingerprint Dive into the research topics of 'Micro-texture and physical properties of the cold-sprayed copper deposit'. Together they form a unique fingerprint.

Cite this