TY - GEN
T1 - Micro Systems for Sustainable Society
AU - Esashi, Masayoshi
PY - 2014/7/28
Y1 - 2014/7/28
N2 - Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. This has been applied to resonator, piezoelectric switch, tactile sensor electron source and other value-added devices.
AB - Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. This has been applied to resonator, piezoelectric switch, tactile sensor electron source and other value-added devices.
KW - MEMS
KW - Micro system
KW - adhesive bonding
KW - hetero-integration
KW - wafer level packaging
UR - http://www.scopus.com/inward/record.url?scp=84934344210&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84934344210&partnerID=8YFLogxK
U2 - 10.1109/IMFEDK.2014.6867043
DO - 10.1109/IMFEDK.2014.6867043
M3 - Conference contribution
AN - SCOPUS:84934344210
T3 - IMFEDK 2014 - 2014 International Meeting for Future of Electron Devices, Kansai
BT - IMFEDK 2014 - 2014 International Meeting for Future of Electron Devices, Kansai
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 12th International Meeting for Future of Electron Devices, Kansai, IMFEDK 2014
Y2 - 19 June 2014 through 20 June 2014
ER -