Micro Systems for Sustainable Society

Masayoshi Esashi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Wafer level adhesive bonding has been applied for the fabrication of micro systems which have heterogeneous components on LSI. Devices formed on a carrier wafer are transferred on a LSI wafer, which makes versatile heterogeneous integration possible. This has been applied to resonator, piezoelectric switch, tactile sensor electron source and other value-added devices.

Original languageEnglish
Title of host publicationIMFEDK 2014 - 2014 International Meeting for Future of Electron Devices, Kansai
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479936144
DOIs
Publication statusPublished - 2014 Jul 28
Event12th International Meeting for Future of Electron Devices, Kansai, IMFEDK 2014 - Kyoto, Japan
Duration: 2014 Jun 192014 Jun 20

Publication series

NameIMFEDK 2014 - 2014 International Meeting for Future of Electron Devices, Kansai

Other

Other12th International Meeting for Future of Electron Devices, Kansai, IMFEDK 2014
CountryJapan
CityKyoto
Period14/6/1914/6/20

Keywords

  • MEMS
  • Micro system
  • adhesive bonding
  • hetero-integration
  • wafer level packaging

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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