TY - GEN
T1 - Micro-raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration
AU - Be, Jichoru
AU - Murugesan, M.
AU - Ohara, Y.
AU - Noriki, A.
AU - Kino, Hisashi
AU - Ri, Kanuku
AU - Fukushima, Takafumi
AU - Tanaka, Tetsu
AU - Koyanagi, Mitsumasa
PY - 2009/12/1
Y1 - 2009/12/1
N2 - Mechanical stress, crystal defects, and metal contamination in thinned silicon substrates with and without intrinsic gettering (IG) zone have been investigated for three-dimensional (3D) integration. The remnant stress existing after wafer thinning was evaluated using angle-(5°) polished silicon wafers by micro-Raman spectroscopy (μRS). The metal contamination in the thinned silicon substrates has been evaluated by a capacitance - time (C-t) measurement method using MOS capacitors in which the thinned silicon substrates were diffus ed with metallic impurities such as Cu and Au used for through-silicon via (TSV) and metal micro-bump in 3D LSI.
AB - Mechanical stress, crystal defects, and metal contamination in thinned silicon substrates with and without intrinsic gettering (IG) zone have been investigated for three-dimensional (3D) integration. The remnant stress existing after wafer thinning was evaluated using angle-(5°) polished silicon wafers by micro-Raman spectroscopy (μRS). The metal contamination in the thinned silicon substrates has been evaluated by a capacitance - time (C-t) measurement method using MOS capacitors in which the thinned silicon substrates were diffus ed with metallic impurities such as Cu and Au used for through-silicon via (TSV) and metal micro-bump in 3D LSI.
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U2 - 10.1109/3DIC.2009.5306568
DO - 10.1109/3DIC.2009.5306568
M3 - Conference contribution
AN - SCOPUS:70549109018
SN - 9781424445127
T3 - 2009 IEEE International Conference on 3D System Integration, 3DIC 2009
BT - 2009 IEEE International Conference on 3D System Integration, 3DIC 2009
T2 - 2009 IEEE International Conference on 3D System Integration, 3DIC 2009
Y2 - 28 September 2009 through 30 September 2009
ER -