Micro-raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration

Jichoru Be; M. Murugesan; Y. Ohara; A. Noriki; Hisashi Kino; Kanuku Ri; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi

doi:10.1109/3DIC.2009.5306568

Micro-raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration

Jichoru Be, M. Murugesan, Y. Ohara, A. Noriki, Hisashi Kino, Kanuku Ri, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Mechanical stress, crystal defects, and metal contamination in thinned silicon substrates with and without intrinsic gettering (IG) zone have been investigated for three-dimensional (3D) integration. The remnant stress existing after wafer thinning was evaluated using angle-(5°) polished silicon wafers by micro-Raman spectroscopy (μRS). The metal contamination in the thinned silicon substrates has been evaluated by a capacitance - time (C-t) measurement method using MOS capacitors in which the thinned silicon substrates were diffus ed with metallic impurities such as Cu and Au used for through-silicon via (TSV) and metal micro-bump in 3D LSI.

Original language	English
Title of host publication	2009 IEEE International Conference on 3D System Integration, 3DIC 2009
DOIs	https://doi.org/10.1109/3DIC.2009.5306568
Publication status	Published - 2009 Dec 1
Event	2009 IEEE International Conference on 3D System Integration, 3DIC 2009 - San Francisco, CA, United States Duration: 2009 Sep 28 → 2009 Sep 30

Publication series

Name	2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Other

Other	2009 IEEE International Conference on 3D System Integration, 3DIC 2009
Country	United States
City	San Francisco, CA
Period	09/9/28 → 09/9/30

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

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Be, J., Murugesan, M., Ohara, Y., Noriki, A., Kino, H., Ri, K., Fukushima, T., Tanaka, T., & Koyanagi, M. (2009). Micro-raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. In 2009 IEEE International Conference on 3D System Integration, 3DIC 2009 [5306568] (2009 IEEE International Conference on 3D System Integration, 3DIC 2009). https://doi.org/10.1109/3DIC.2009.5306568

Micro-raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. / Be, Jichoru; Murugesan, M.; Ohara, Y.; Noriki, A.; Kino, Hisashi; Ri, Kanuku; Fukushima, Takafumi ; Tanaka, Tetsu; Koyanagi, Mitsumasa.

2009 IEEE International Conference on 3D System Integration, 3DIC 2009. 2009. 5306568 (2009 IEEE International Conference on 3D System Integration, 3DIC 2009).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Be, J, Murugesan, M, Ohara, Y, Noriki, A, Kino, H, Ri, K, Fukushima, T , Tanaka, T & Koyanagi, M 2009, Micro-raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. in 2009 IEEE International Conference on 3D System Integration, 3DIC 2009., 5306568, 2009 IEEE International Conference on 3D System Integration, 3DIC 2009, 2009 IEEE International Conference on 3D System Integration, 3DIC 2009, San Francisco, CA, United States, 09/9/28. https://doi.org/10.1109/3DIC.2009.5306568

Be J, Murugesan M, Ohara Y, Noriki A, Kino H, Ri K et al. Micro-raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. In 2009 IEEE International Conference on 3D System Integration, 3DIC 2009. 2009. 5306568. (2009 IEEE International Conference on 3D System Integration, 3DIC 2009). https://doi.org/10.1109/3DIC.2009.5306568

Be, Jichoru ; Murugesan, M. ; Ohara, Y. ; Noriki, A. ; Kino, Hisashi ; Ri, Kanuku ; Fukushima, Takafumi ; Tanaka, Tetsu ; Koyanagi, Mitsumasa. / Micro-raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 2009 IEEE International Conference on 3D System Integration, 3DIC 2009. 2009. (2009 IEEE International Conference on 3D System Integration, 3DIC 2009).

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AU - Kino, Hisashi

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