Abstract
Wafer process packaging using electrical feedthrough from glass holes has been applied for micromechanical sensors as electrostatically levitating micro motors (10,000 rpm) for rotational gyroscopes. Active catheters and sensors for them have been developed as maintenance tools used in narrow space. Silicon microstructures made by the deep RIE was used as molds for making ceramic microstructures. Hydrogen storage capacity of carbon nanotube was measured from the resonant frequency change of thin silicon cantilever which have the carbon nanotube on it. Multiprobe data storage devices have been fabricated using thermal probes of which tip size is 30 nm. The electrical feedthrough from the multiprobe was fabricated in a Pyrex glass plate by using Deep RIE (Reactive Ion Etching) and nickel electroplating. High density data recording to a phase change media (GeSbTe) was performed.
Original language | English |
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Pages (from-to) | 1-8 |
Number of pages | 8 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 4592 |
DOIs | |
Publication status | Published - 2001 Dec 1 |
Event | Device and Process Technologies for MEMS and Microelectronics II - Adelaide, Australia Duration: 2001 Dec 17 → 2001 Dec 19 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering