Micro-nanosystems by bulk silicon micromachining

Masayoshi Esashi

Research output: Contribution to journalConference articlepeer-review

Abstract

Wafer process packaging using electrical feedthrough from glass holes has been applied for micromechanical sensors as electrostatically levitating micro motors (10,000 rpm) for rotational gyroscopes. Active catheters and sensors for them have been developed as maintenance tools used in narrow space. Silicon microstructures made by the deep RIE was used as molds for making ceramic microstructures. Hydrogen storage capacity of carbon nanotube was measured from the resonant frequency change of thin silicon cantilever which have the carbon nanotube on it. Multiprobe data storage devices have been fabricated using thermal probes of which tip size is 30 nm. The electrical feedthrough from the multiprobe was fabricated in a Pyrex glass plate by using Deep RIE (Reactive Ion Etching) and nickel electroplating. High density data recording to a phase change media (GeSbTe) was performed.

Original languageEnglish
Pages (from-to)1-8
Number of pages8
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4592
DOIs
Publication statusPublished - 2001 Dec 1
EventDevice and Process Technologies for MEMS and Microelectronics II - Adelaide, Australia
Duration: 2001 Dec 172001 Dec 19

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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