Metallurgical and electrical characterization of ultrathin CoTix liner/barrier for Cu interconnects

Maryamsadat Hosseini, Junichi Koike

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper reports an amorphous CoTix alloy as a single-layer liner/barrier material for intermediate interconnects in place of bilayer Ta/TaN materials. The CoTix layer was found to enhance adhesion of Cu/SiO2. The CoTix layer stayed amorphous after annealing at 400°C, and started to crystallize at 500°C. Capacitance-voltage measurement of the samples showed no interdiffusion of Cu ions into SiO2 after annealing up to 600°C and after bias thermal stress at 250°C at 3 MV/cm. All the obtained results showed that the amorphous CoTix alloy is a promising material for a liner/barrier layer in advanced technology node.

Original languageEnglish
Title of host publicationIITC 2017 - 2017 IEEE International Interconnect Technology Conference
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509064731
DOIs
Publication statusPublished - 2017 Jul 5
Event2017 IEEE International Interconnect Technology Conference, IITC 2017 - Hsinchu, Taiwan, Province of China
Duration: 2017 May 162017 May 18

Publication series

NameIITC 2017 - 2017 IEEE International Interconnect Technology Conference

Other

Other2017 IEEE International Interconnect Technology Conference, IITC 2017
CountryTaiwan, Province of China
CityHsinchu
Period17/5/1617/5/18

Keywords

  • Co alloy
  • LSI
  • diffusion barrier
  • interconnect

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys
  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Metallurgical and electrical characterization of ultrathin CoTi<sub>x</sub> liner/barrier for Cu interconnects'. Together they form a unique fingerprint.

  • Cite this

    Hosseini, M., & Koike, J. (2017). Metallurgical and electrical characterization of ultrathin CoTix liner/barrier for Cu interconnects. In IITC 2017 - 2017 IEEE International Interconnect Technology Conference [7968959] (IITC 2017 - 2017 IEEE International Interconnect Technology Conference). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IITC-AMC.2017.7968959