TY - GEN
T1 - Metallurgical and electrical characterization of ultrathin CoTix liner/barrier for Cu interconnects
AU - Hosseini, Maryamsadat
AU - Koike, Junichi
PY - 2017/7/5
Y1 - 2017/7/5
N2 - This paper reports an amorphous CoTix alloy as a single-layer liner/barrier material for intermediate interconnects in place of bilayer Ta/TaN materials. The CoTix layer was found to enhance adhesion of Cu/SiO2. The CoTix layer stayed amorphous after annealing at 400°C, and started to crystallize at 500°C. Capacitance-voltage measurement of the samples showed no interdiffusion of Cu ions into SiO2 after annealing up to 600°C and after bias thermal stress at 250°C at 3 MV/cm. All the obtained results showed that the amorphous CoTix alloy is a promising material for a liner/barrier layer in advanced technology node.
AB - This paper reports an amorphous CoTix alloy as a single-layer liner/barrier material for intermediate interconnects in place of bilayer Ta/TaN materials. The CoTix layer was found to enhance adhesion of Cu/SiO2. The CoTix layer stayed amorphous after annealing at 400°C, and started to crystallize at 500°C. Capacitance-voltage measurement of the samples showed no interdiffusion of Cu ions into SiO2 after annealing up to 600°C and after bias thermal stress at 250°C at 3 MV/cm. All the obtained results showed that the amorphous CoTix alloy is a promising material for a liner/barrier layer in advanced technology node.
KW - Co alloy
KW - LSI
KW - diffusion barrier
KW - interconnect
UR - http://www.scopus.com/inward/record.url?scp=85027143615&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85027143615&partnerID=8YFLogxK
U2 - 10.1109/IITC-AMC.2017.7968959
DO - 10.1109/IITC-AMC.2017.7968959
M3 - Conference contribution
AN - SCOPUS:85027143615
T3 - IITC 2017 - 2017 IEEE International Interconnect Technology Conference
BT - IITC 2017 - 2017 IEEE International Interconnect Technology Conference
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2017 IEEE International Interconnect Technology Conference, IITC 2017
Y2 - 16 May 2017 through 18 May 2017
ER -