TY - GEN
T1 - Metallic glass nanofibers in future hydrogel-based scaffolds
AU - Sadeghian, Ramin Banan
AU - Ahadian, Samad
AU - Yaginuma, Shin
AU - Ramon-Azcon, Javier
AU - Liang, Xiaobin
AU - Nakajima, Ken
AU - Shiku, Hitoshi
AU - Matsue, Tomokazu
AU - Nakayama, Koji S.
AU - Khademhosseini, Ali
N1 - Publisher Copyright:
© 2014 IEEE.
PY - 2014/11/2
Y1 - 2014/11/2
N2 - Electrically conductive reinforced hydrogels offer a wide range of applications as three-dimensional scaffolds in tissue engineering. We report electrical and mechanical characterization of methacrylated gelatin (GelMA) hydrogel, containing palladium-based metallic glass nanofibers (MGNF). Also we show that the fibers are biocompatible and C2C12 myoblasts in particular, planted into the hybrid hydrogel, tend to attach to and elongate along the fibers. The MGNFs in this work were created by gas atomization. Ravel of fibers were embedded in the GelMA prepolymer in two different concentrations (0.5 and 1.0 mg/ml), and then the ensemble was cured under UV light, forming the hybrid hydrogel. The conductivity of the hybrid hydrogel was proportional to the fiber concentration.
AB - Electrically conductive reinforced hydrogels offer a wide range of applications as three-dimensional scaffolds in tissue engineering. We report electrical and mechanical characterization of methacrylated gelatin (GelMA) hydrogel, containing palladium-based metallic glass nanofibers (MGNF). Also we show that the fibers are biocompatible and C2C12 myoblasts in particular, planted into the hybrid hydrogel, tend to attach to and elongate along the fibers. The MGNFs in this work were created by gas atomization. Ravel of fibers were embedded in the GelMA prepolymer in two different concentrations (0.5 and 1.0 mg/ml), and then the ensemble was cured under UV light, forming the hybrid hydrogel. The conductivity of the hybrid hydrogel was proportional to the fiber concentration.
KW - Conductive hydrogel scaffolds
KW - Metallic glass nanofibers
KW - Methacrylated gelatin
UR - http://www.scopus.com/inward/record.url?scp=84929484330&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84929484330&partnerID=8YFLogxK
U2 - 10.1109/EMBC.2014.6944816
DO - 10.1109/EMBC.2014.6944816
M3 - Conference contribution
C2 - 25571184
AN - SCOPUS:84929484330
T3 - 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2014
SP - 5276
EP - 5279
BT - 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2014
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2014 36th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2014
Y2 - 26 August 2014 through 30 August 2014
ER -