MEMS wafer-level packaging technology using LTCC wafer

Mamoru Mohri, Masayoshi Esashi, Shuji Tanaka

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

This paper describes a versatile and reliable wafer-level hermetic packaging technology using an anodically-bondable low temperature co-fired ceramic (LTCC) wafer, in which multi-layer electrical feedthroughs can be embedded. The LTCC wafer allows many kinds of micro electro mechanical systems (MEMS) to be more flexibly designed and more easily packaged. The hermeticity of vacuum-sealed cavities was confirmed after 3000 cycles of thermal shock (-40 °C × 30 min/ +125 °C × 30 min) by diaphragm method. To practically apply the LTCC wafer to a variety of MEMS, the electrical connection between MEMS on a Si wafer and feedthroughs in the LTCC should be established by a simple and reliable method. We have developed a new electrical connection methods; The electrical connection is established by porous Au bumps, which are a part of Au vias exposed in wet-etched cavities on the LTCC wafer. 100 % yield of both electrical connection and hermetic sealing was demonstrated. A thermal shock test up to 3000 cycles confirmed the reliability of this packaging technology.

Original languageEnglish
Pages (from-to)246-253
Number of pages8
JournalIEEJ Transactions on Sensors and Micromachines
Volume132
Issue number8
DOIs
Publication statusPublished - 2012

Keywords

  • Anodic bonding
  • Electrical connection
  • Hermetic packaging
  • LTCC wafer
  • MEMS
  • Wafer-level packaging

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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