MEMS technology: Optical application, medical application and SOC application

Masayoshi Esashi

MEMS technology: Optical application, medical application and SOC application

Masayoshi Esashi

Micro System Integration Center (μSIC)

Research output: Contribution to conference › Paper › peer-review

4 Citations (Scopus)

Abstract

MEMS (Micro ElectroMechanical Systems) have been developed based on a silicon bulk micromachining. Wafer process packaging was applied to electrostatically levitated rotational gyroscope and micro relay. High density electrical feedthrough made by glass deep RIE and metal electroplating enabled array MEMS as multiprobe data storage and contactor for LSI probing. Fine diameter fiber optic sensors for pressure and SNOM were developed. Hydrogen storage capacity of carbon nanotube was measured using resonant frequency shift of thin silicon cantilever.

Original language	English
Pages	6-11
Number of pages	6
Publication status	Published - 2002 Jan 1
Event	2002 Symposium on VLSI Technology Digest of Technical Papers - Honolulu, HI, United States Duration: 2002 Jun 11 → 2002 Jun 13

Other

Other	2002 Symposium on VLSI Technology Digest of Technical Papers
Country	United States
City	Honolulu, HI
Period	02/6/11 → 02/6/13

ASJC Scopus subject areas

Engineering(all)

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Cite this

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title = "MEMS technology: Optical application, medical application and SOC application",

abstract = "MEMS (Micro ElectroMechanical Systems) have been developed based on a silicon bulk micromachining. Wafer process packaging was applied to electrostatically levitated rotational gyroscope and micro relay. High density electrical feedthrough made by glass deep RIE and metal electroplating enabled array MEMS as multiprobe data storage and contactor for LSI probing. Fine diameter fiber optic sensors for pressure and SNOM were developed. Hydrogen storage capacity of carbon nanotube was measured using resonant frequency shift of thin silicon cantilever.",

author = "Masayoshi Esashi",

year = "2002",

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AB - MEMS (Micro ElectroMechanical Systems) have been developed based on a silicon bulk micromachining. Wafer process packaging was applied to electrostatically levitated rotational gyroscope and micro relay. High density electrical feedthrough made by glass deep RIE and metal electroplating enabled array MEMS as multiprobe data storage and contactor for LSI probing. Fine diameter fiber optic sensors for pressure and SNOM were developed. Hydrogen storage capacity of carbon nanotube was measured using resonant frequency shift of thin silicon cantilever.

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