Abstract
MEMS (Micro ElectroMechanical Systems) have been developed based on a silicon bulk micromachining. Wafer process packaging was applied to electrostatically levitated rotational gyroscope and micro relay. High density electrical feedthrough made by glass deep RIE and metal electroplating enabled array MEMS as multiprobe data storage and contactor for LSI probing. Fine diameter fiber optic sensors for pressure and SNOM were developed. Hydrogen storage capacity of carbon nanotube was measured using resonant frequency shift of thin silicon cantilever.
| Original language | English |
|---|---|
| Pages | 6-11 |
| Number of pages | 6 |
| Publication status | Published - 2002 Jan 1 |
| Event | 2002 Symposium on VLSI Technology Digest of Technical Papers - Honolulu, HI, United States Duration: 2002 Jun 11 → 2002 Jun 13 |
Other
| Other | 2002 Symposium on VLSI Technology Digest of Technical Papers |
|---|---|
| Country/Territory | United States |
| City | Honolulu, HI |
| Period | 02/6/11 → 02/6/13 |
ASJC Scopus subject areas
- Engineering(all)