MEMS on LSI by adhesive bonding and wafer level packaging

Masayoshi Esashi, Shuji Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Resonators and switches are fabricated on LSI for advance wireless communication systems. In addition to surface micromachining, adhesive bonding has been applied for the fabrication. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromachining. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer (wafer bonding first approach). SAW filters are made by bonding a MEMS wafer to a LSI wafer (wafer bonding last approach). Variable capacitors are fabricated on a piezoelectric LiNbO3 wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared wafer, prototyping facility and hands-on access fabrication facility are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

Original languageEnglish
Title of host publicationHeterogeneous Integration Challenges of MEMS, Sensor and CMOS LSI
Pages38-49
Number of pages12
DOIs
Publication statusPublished - 2012 Dec 1
Event2012 MRS Spring Meeting - San Francisco, CA, United States
Duration: 2012 Apr 92012 Apr 13

Publication series

NameMaterials Research Society Symposium Proceedings
Volume1427
ISSN (Print)0272-9172

Other

Other2012 MRS Spring Meeting
CountryUnited States
CitySan Francisco, CA
Period12/4/912/4/13

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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