MEMS on LSI

Masayoshi Esashi, S. Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Three kinds of MEMS on LSI are described. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromaching on a LSI wafer. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer. SAW filters are made by bonding a MEMS wafer to a LSI wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared LSI, prototyping facility and hands-on access fab. are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

Original languageEnglish
Title of host publicationSilicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
PublisherElectrochemical Society Inc.
Pages319-330
Number of pages12
Edition2
ISBN (Electronic)9781607682134
ISBN (Print)9781566778633
DOIs
Publication statusPublished - 2011
Externally publishedYes

Publication series

NameECS Transactions
Number2
Volume35
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

ASJC Scopus subject areas

  • Engineering(all)

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