MEMS on LSI

Masayoshi Esashi; S. Tanaka

doi:10.1149/1.3568875

MEMS on LSI

Masayoshi Esashi, S. Tanaka

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Three kinds of MEMS on LSI are described. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromaching on a LSI wafer. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer. SAW filters are made by bonding a MEMS wafer to a LSI wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared LSI, prototyping facility and hands-on access fab. are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

Original language	English
Title of host publication	Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
Publisher	Electrochemical Society Inc.
Pages	319-330
Number of pages	12
Edition	2
ISBN (Electronic)	9781607682134
ISBN (Print)	9781566778633
DOIs	https://doi.org/10.1149/1.3568875
Publication status	Published - 2011
Externally published	Yes

Publication series

Name	ECS Transactions
Number	2
Volume	35
ISSN (Print)	1938-5862
ISSN (Electronic)	1938-6737

ASJC Scopus subject areas

Engineering(all)

Access to Document

10.1149/1.3568875

Cite this

@inproceedings{f04210fc68ac4c83a1b9e3cfbb32c8e1,

title = "MEMS on LSI",

abstract = "Three kinds of MEMS on LSI are described. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromaching on a LSI wafer. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer. SAW filters are made by bonding a MEMS wafer to a LSI wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared LSI, prototyping facility and hands-on access fab. are discussed to reduce a cost and a risk in the development of the MEMS on LSI.",

author = "Masayoshi Esashi and S. Tanaka",

year = "2011",

doi = "10.1149/1.3568875",

language = "English",

isbn = "9781566778633",

series = "ECS Transactions",

publisher = "Electrochemical Society Inc.",

number = "2",

pages = "319--330",

booktitle = "Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications",

edition = "2",

}

TY - GEN

T1 - MEMS on LSI

AU - Esashi, Masayoshi

AU - Tanaka, S.

PY - 2011

Y1 - 2011

N2 - Three kinds of MEMS on LSI are described. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromaching on a LSI wafer. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer. SAW filters are made by bonding a MEMS wafer to a LSI wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared LSI, prototyping facility and hands-on access fab. are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

AB - Three kinds of MEMS on LSI are described. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromaching on a LSI wafer. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer. SAW filters are made by bonding a MEMS wafer to a LSI wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared LSI, prototyping facility and hands-on access fab. are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

UR - http://www.scopus.com/inward/record.url?scp=79960819752&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79960819752&partnerID=8YFLogxK

U2 - 10.1149/1.3568875

DO - 10.1149/1.3568875

M3 - Conference contribution

AN - SCOPUS:79960819752

SN - 9781566778633

T3 - ECS Transactions

SP - 319

EP - 330

BT - Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications

PB - Electrochemical Society Inc.

ER -

MEMS on LSI

Abstract

Publication series

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this