@inproceedings{f04210fc68ac4c83a1b9e3cfbb32c8e1,
title = "MEMS on LSI",
abstract = "Three kinds of MEMS on LSI are described. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromaching on a LSI wafer. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer. SAW filters are made by bonding a MEMS wafer to a LSI wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared LSI, prototyping facility and hands-on access fab. are discussed to reduce a cost and a risk in the development of the MEMS on LSI.",
author = "M. Esashi and S. Tanaka",
year = "2011",
doi = "10.1149/1.3568875",
language = "English",
isbn = "9781566778633",
series = "ECS Transactions",
number = "2",
pages = "319--330",
booktitle = "Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications",
edition = "2",
note = "Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications - 219th ECS Meeting ; Conference date: 02-05-2011 Through 04-05-2011",
}