MEMS on LSI

M. Esashi, S. Tanaka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Three kinds of MEMS on LSI are described. Lamb wave resonators are fabricated for multi-frequency oscillators by surface micromaching on a LSI wafer. Multi-band filters are formed by a MEMS process after bonding a Si wafer to a LSI wafer. SAW filters are made by bonding a MEMS wafer to a LSI wafer. Wafer level packaging techniques are developed to encapsulate the MEMS on LSI. Open collaboration as shared LSI, prototyping facility and hands-on access fab. are discussed to reduce a cost and a risk in the development of the MEMS on LSI.

Original languageEnglish
Title of host publicationSilicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications
Pages319-330
Number of pages12
Edition2
DOIs
Publication statusPublished - 2011
EventSilicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications - 219th ECS Meeting - Montreal, QC, Canada
Duration: 2011 May 22011 May 4

Publication series

NameECS Transactions
Number2
Volume35
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Other

OtherSilicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications - 219th ECS Meeting
CountryCanada
CityMontreal, QC
Period11/5/211/5/4

ASJC Scopus subject areas

  • Engineering(all)

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